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Plasma Etch (RIE, ICP-RIE, DRIE);
Plasma Enhanced Deposition (ICP-CVD, PECVD);
Atomic Layer Deposition
Pressure, Flow
Level & Temperature Products for
Ultra Clean Processing
In-Line Scrubber system to remove harmfull constituents
from the effluent gases of LPCVD,PECVD and MOCVD systems.

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